Qualcomm Inc (NASDAQ:QCOM, XETRA:QCI) and Amazon.com Inc (NASDAQ:AMZN) on Tuesday announced a multi-generation collaboration to develop customized silicon for large-scale AI data centers, with an initial focus on AI inference for Amazon Web Services.
The news sent Qualcomm shares up 4.5% on Tuesday morning in New York.
The companies said they will also work together on advanced optical connectivity solutions for data centers, supporting speeds up to 1.6T and future generations, using Qualcomm's SerDes and optical DSP technology.
As part of the expanded partnership, Qualcomm plans to increase its use of AWS AI infrastructure, including Amazon Bedrock, for electronic design automation workloads, aiming to shorten chip design cycles.
"As AI demand accelerates, data center infrastructure will require advances in both computing and connectivity to deliver greater performance with more efficiency," said Cristiano Amon, CEO of Qualcomm.
"Qualcomm is pleased to work with AWS on customized silicon and connectivity solutions, bringing decades of leadership in advanced processing and power-efficient compute, to deliver breakthrough performance and enable the next generation of AI infrastructure."
Prasad Kalyanaraman, vice president at AWS, said the collaboration builds on a "strong foundation of partnership" and reflects a shared commitment to advancing customized silicon and connectivity, aiming to deliver more performant, efficient and cost-effective infrastructure for customers.
