Nvidia Corp (NASDAQ:NVDA, ETR:NVD) has produced its first Blackwell wafer in the US at Taiwan Semiconductor Manufacturing Company’s (TSMC) Phoenix facility.
The wafer is the base material for Nvidia’s next-generation Blackwell AI chips, designed to improve performance while reducing energy consumption and cost compared with previous architectures.
The Arizona facility produces advanced chips using two-, three-, and four-nanometer processes, supporting applications in AI, telecommunications, and high-performance computing.
At a ceremony at the Phoenix site, Nvidia CEO Jensen Huang an TSMC vice president of operations YL Wang, signed the first US-made Blackwell wafer to mark its volume production.
“This is a historic moment for several reasons. It’s the very first time in recent American history that the single most important chip is being manufactured here in the United States by the most advanced fab, by TSMC, here in the United States,” Huang said at the event.
“This is the vision of President Trump of reindustrialization — to bring back manufacturing to America, to create jobs, of course, but also, this is the single most vital manufacturing industry and the most important technology industry in the world.”
The wafer will undergo additional processing, including layering, patterning, etching, and dicing, before becoming a finished Blackwell AI chip.
While some final packaging will still be completed in Taiwan, domestic production is expected to strengthen the US semiconductor supply chain and reduce reliance on international shipments, according to Nvidia.
Nvidia added that it plans to continue expanding its AI infrastructure investments in the US, working with TSMC, Foxconn, and other partners as part of a broader effort to develop domestic AI capabilities.
Shares of Nvidia added 0.3% at $183 on Monday morning, up more than 35% so far this year.