Digi Power X Inc (NASDAQ:DGXX, TSX-V:DGX) announced that its subsidiary US Data Centers has filed a provisional utility patent application for the ARMS 200 platform with the United States Patent and Trademark Office.
The ARMS 200, or AI-Ready Modular Solution, is a Tier 3-certified modular data center platform designed to support high-density GPU clusters, the company said.
“This provisional patent is the first step to protect the foundational architecture of our ARMS 200 platform,” Digi Power X CEO Michel Amar said.
“Combined with our Supermicro partnership and Tier 3-certified design, we are positioning ourselves to scale the ARMS 200 from first deployments expected later this year into a full-fledged AI infrastructure network.”
Each pod of the ARMS 200 platform delivers one megawatt of compute capacity and is configured for up to 256 NVIDIA B200 or B300 GPUs, the company said.
The platform is designed for rapid deployment across enterprise, sovereign, and cloud-scale AI applications.
Digi Power X intends to scale the ARMS 200 to 40 megawatts of critical power, totaling 55 megawatts, at its flagship site in Alabama. This deployment is expected to support approximately 10,240 NVIDIA GPUs.
The ARMS 200 includes liquid cooling, dual-path power redundancy, and Digi Power X’s NeoCloud orchestration system for GPU-as-a-Service operations.
It is being developed in collaboration with Super Micro Computer Inc (NASDAQ:SMCI) and is designed to support NVIDIA’s Blackwell-class architecture.
Digi Power X previously announced a purchase order with Supermicro for NVIDIA B200-powered systems to initiate the ARMS 200 rollout. The initial deployment of the ARMS 200 platform is scheduled for the fourth quarter of 2025.
The ARMS 200 patent application is the first in a planned series of modular systems from US Data Centers, which also includes the upcoming ARMS 300 and ARMS 400 platforms.