Ethernity Networks Ltd (AIM:ENET, OTCQB:ENETF) said a number of telco network operators will be trialling its new virtual UEP2025 bonding product following a live demo at the recent WISP America (wireless internet service provider) event in Kentucky.
Initial units will be integrated by potential customers during the coming quarter, following which Ethernity expects deployment into the rest of these operators' networks, which it said could lead to larger orders for UEP2025.
One OEM customer, which took the product for testing in January, has already started to supply the bonding product to large WISP-based customers in anticipation of orders for the product, Ethernity added.
David Levi, chief executive, commented: "We have believed from the outset that our patented link bonding technology has the potential to be a game changer for the wireless industry.
“With the release of the UEP2025 product with bonding support, software configuration and management software, we believe that we are delivering a must-have offering for high-capacity wireless delivery."
UEP2025 can dynamically distribute data along multiple wireless links of the same or different speeds and technologies, overcoming lost connections and degraded capacities due to environmental factors, regardless of the radio vendor, Ethernity added.